GIGABYTE B550 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
The benefits of AMD StoreMI:
• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users’ computing behaviors
ULTIMATE POWER DESIGN
To fully support the latest 3rd Gen AMD Ryzen™ processors, B550 AORUS motherboards equip with the ultimate power solution which is power balanced, digital and multiple phases. After countless experiments and testing, GIGABYTE presents the unbeatable B550 AORUS motherboards for enthusiast. No Compromise and never stop to achieve higher.
Digital Twin Power Design
Digital PWMDriver MOSFETAll-Solid CapacitorCPU Power Connector
10*+2 Phases Digital Twin Power Design
Digital PWM Controller delivers appropriate voltage to the CPU
With 10+2 Phases 50A DrMOS, each power phase connects to the CPU and provides more balanced and efficient power delivery. With capability to handle up to 600 Amps current in a total
All-solid capacitors to improve Transient response and minimize oscillation
24pin+8pin Solid Pin CPU Power Connectors
B550M AORUS PRO-P motherboard uses a 10+2 phases Digital Twin Power Design which includes PWM controller, DrMOS and Ferrite core choke as high quality selected components. These 100% digital controller offer incredible precision in delivering power to the motherboard’s most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from 3rd Gen AMD Ryzen™ processors.
*5+5 Phases parallel power design
2X Copper PCB
GIGABYTE’s exclusive 2X Copper PCBs design provides sufficient power trace paths between components to handle greater than normal power loads and to remove heat from the critical CPU power delivery area. This is essential to ensure the motherboard is able to handle the increased power loading that is necessary when overclocking.
GIGABYTE realize that customer won’t stop chasing a better computing performance. We take care of it and implement on products. Adopting Daisy Chain, apply PCIe 4.0 components to get B550 motherboards ready to enter next generation and get upgrade.
Memory Layout – Daisy Chain Design
With the optimized daisy-chain routing, the B550 motherboard provides a proven speed of DDR4-4000MHz and beyond with high density memory modules*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, providing professional gamers a denser and faster system memory experience.
* Performance may vary in circumstances. Please refer to the QVL list for detail support information.
Single 32GB Support
With populated 2 DIMMs per channel on GIGABYTE B550 motherboards, the maximum memory capacity support is 128GB. For users who always run out of memory capacity, they are able to enjoy more bandwidth now for memory-intensive application such as rendering and video editing.
PCIe 4.0 Slot
Reinforces PCIe 4.0 x16/x8/x4* bandwidth with lower impedance. * Actual support may vary by CPu
M.2 PCIe 4.0 Slot
M.2 PCIe 4.0 x4 slot with lower impedance
* Product uses PCIe 4.0 grade material, actual support varies by hardware configuration
B550 AORUS motherboards offer the industry’s best compatibility in terms of NVMe storage for users who demand high capacity and seek the best performance. AORUS’ unique design can be configured in RAID for record speeds of up to 6560 MB/s (Sequential Read), making AORUS the obvious choice for the ultimate PC.
ADVANCED THERMAL SOLUTION
Unthrottled performance is guaranteed by the advanced thermal solution which including Heatsinks and Thermal Guards. B550 motherboards are cool on MOSFETs and M.2 SSDs even on full loading. It provides lower temperatures for users.
Pre-Installed IO Armor
Enlarged MOSFET Heatsink
Thermal Guard for M.2
AORUS M.2 Thermal Guard
GIGABYTE Ultra-Efficient M.2 Thermal Guard
With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.
Thermal Throttling As Temperature Rises
Smart Fan 5
With Smart Fan 5 users can ensure that their gaming PC can maintain its performance while staying cool. Smart Fan 5 allows users to interchange their fan headers to reflect different thermal sensors at different locations on the motherboard. Not only that, with Smart Fan 5 more hybrid fan headers that support both PWM and Voltage mode fans have been introduced to make the motherboard more liquid cooling friendly.
Fan / Water Pump Connectors
Internal Temperature Sensors
Hybrid Fan Headers
■ 5 Fan / Water Pump Connectors
■ 6 Temperature Sensors
■ All Hybrid Fan Headers
■ All Fan Pin Headers Upgraded to Hybrid Fan Headers
■ Interoperable Fans and Sensors
■ Intuitive UI for Fan Control
* Different models have a different number of fan pin headers and temperature sensors. Smart Fan 5 function may vary by model.
NEXT GENERATION CONNECTIVITY
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. B550 AORUS motherboards provide all next generation network and storage to keep you up to speed.
2.5GbE LAN Onboard
2X Faster than ever
Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least two times faster transfer speeds as compared to general 1GbE networking. It’s perfectly suit for gamers and streamer with ultimate and smooth online experience. It also backward compatible with Multi-Gig (10/100/1000/2500Mbps)of RJ-45 ethernet.
HDMI 2.1 for 4K / 60P / 21:9 / HDCP 2.3 Support
HDMI 2.1, which is backwards compatible with HDMI 2.0/ 1.4 and offering 48 Gb/s of bandwidth – twice times more than previous generation. This unlocks the potential for users to transfer multiple video streams, as well as a native cinematic 21:9 ratio (which most movies are shot in), Full HDR and HDCP 2.3 support, to offer the best visual experience for viewers.
Note: Only New Gen AMD Ryzen™ with Radeon™ Graphics processors support displaying function.
Native USB 3.2 Gen2
AMD B550 chipset provides native USB 3.2 Gen2 ports with speeds up to 10Gbps. Available over the USB Type-A connector, the USB3.2 Gen2 is much improved with twice the bandwidth compared to its previous generation as well as backwards compatibility with USB2.0 and USB3.2 Gen1.
HI-FI AUDIO SYSTEM
For enthusiasts, sound quality is just as essential to the gaming experience. B550 motherboards are equipped with high quality audio components to provide a superb audio experience. The exclusive AORUS AMP-UP Audio technology makes for the ideal onboard sound solution for the most demanding audiophiles.
High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
AMD Socket AM4, support for: AMD Ryzen™ 5000 Series/ 3rd Gen Ryzen™ and 3rd Gen Ryzen™ with Radeon™ Graphics Processors
(Please refer “CPU Support List” for more information.)
4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
3rd Gen AMD Ryzen™ Processors:
Support for DDR4 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules
3rd Gen AMD Ryzen™ with Radeon™ Graphics processors:
Support for DDR4 4733(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(Please refer “Memory Support List” for more information.)
Integrated in the 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors:
1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
* Support for HDMI 2.1 version, HDCP 2.3, and HDR.
1 x DisplayPort, supporting a maximum resolution of 5120×2880@60 Hz
* Support for DisplayPort 1.4 version, HDCP 2.3, and HDR.
Maximum shared memory of 16 GB
Realtek® ALC1200 codec
High Definition Audio
Support for S/PDIF Out
Realtek® 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)
1 x PCI Express x16 slot (PCIEX16), integrated in the CPU:
3rd Generation AMD Ryzen™ processors support PCIe 4.0 x16 mode
3rd Generation AMD Ryzen™ with Radeon™ Graphics processors support PCIe 3.0 x16 mode
* For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
1 x PCI Express x16 slot (PCIEX4), integrated in the Chipset:
Supporting PCIe 3.0 x4 mode
1 x PCI Express x1 slot (PCIEX1), integrated in the Chipset:
Supporting PCIe 3.0 x1 mode
1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs:
3rd Generation AMD Ryzen™ processors support SATA and PCIe 4.0 x4/x2 SSDs
3rd Generation AMD Ryzen™ with Radeon™ Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs
1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2260/2280 SSDs:
Supporting SATA and PCIe 3.0 x4/x2 SSDs
4 x SATA 6Gb/s connectors, integrated in the Chipset:
Support for RAID 0, RAID 1, and RAID 10
4 x USB 3.2 Gen 1 ports on the back panel
1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support
1 x USB 3.2 Gen 2 Type-A port (red) on the back panel
2 x USB 3.2 Gen 1 ports available through the internal USB header
4 x USB 2.0/1.1 ports available through the internal USB headers
Chipset+1 USB 2.0 Hub:
4 x USB 2.0/1.1 ports on the back panel
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x water cooling CPU fan header
3 x system fan headers
2 x addressable LED strip headers
2 x RGB LED strip headers
1 x CPU cooler LED strip/RGB LED strip header
2 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x serial port header
1 x Trusted Platform Module (TPM) header (2×6 pin, for the GC-TPM2.0_S module only)
1 x Thunderbolt™ add-in card connector
1 x Clear CMOS jumper
Back Panel Connectors
4 x USB 2.0/1.1 ports
1 x DisplayPort
1 x HDMI port
4 x USB 3.2 Gen 1 ports
1 x USB 3.2 Gen 2 Type-A port (red)
1 x USB Type-C™ port, with USB 3.2 Gen 2 support
1 x Q-Flash Plus button
1 x RJ-45 port
1 x optical S/PDIF Out connector
5 x audio jacks
iTE® I/O Controller Chip
Fan speed detection
Water cooling flow rate detection
Fan fail warning
Fan speed control
* Whether the fan speed control function is supported will depend on the cooler you install.
1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Support for APP Center
* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
System Information Viewer
Support for Q-Flash Plus
Support for Q-Flash
Support for Xpress Install
Norton® Internet Security (OEM version)
Realtek® 8125 Gaming LAN Bandwidth Control Utility
Support for Windows 10 64-bit
Micro ATX Form Factor; 24.4cm x 24.4cm
Due to different Linux support condition provided by chipset vendors, please download Linux driver from chipset vendors’ website or 3rd party website.
Most hardware/software vendors may no longer offer drivers to support Win9X/ME/2000/XP. If drivers are available from the vendors, we will update them on the GIGABYTE website.
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.